Innovation
Our US partner company Total Technologies Ltd. has developed numerous products and components for electronic connectivity. At present, we hold more than 20 global patents. The TTL group’s products comply with UL, CSA and CE standards. In addition, we have been the first company worldwide to receive approval for USB 2.0 high/full speed cables and to use the new USB 2.0 high speed logo.
USB 3.0
For ten years, USB 2.0 has been the industry standard in connectivity, linking the PC to a wide range of peripherals from the mouse to the hard disk. Data is transferred with up to 480 MBit/sec – theoretically at least. Plug & play has made installation as simple as can be.
But USB 2.0’s time is up. Transfer rates and features do not meet today’s requirements anymore. Especially external mass storage such as hard disks, flash drives and optical drives are thwarted by the old standard. USB 3.0 SuperSpeed overcomes this: with up to 5 GBit/sec, data can be transferred ten times faster.
HDMI 1.4
HDMI has been updated as well. The small step in version number from 1.3 to 1.4 brings big news: the digital A/V standard High-Definition
Multimedia Interface (HDMI) now offers 3D, 4K resolution and an integrated Fast Ethernet channel (HDMI Ethernet Channel, HEC for short),
taking into account the increasing networking abilities of consumer electronics among
each other and with the internet.
SupraLok
The patented uni-screw SupraLokTM system is the first HDMI permanent locking system accepted and confirmed by HDMI Licensing LLC. This legacy design is backwards-compatible and can be easily adopted without changing any PCB footprint on existing HDMI connectors.
RF-BLOK
The extremely tough housing for all TTL connectors offers increased insulation resistance and higher quality in signal transfer. The patented system consists of a one-piece EMI/RFI shield, thus reducing interferences corrupting the transferred signal.
Insulation Resistance is increased by up to 25%.
The RF-BLOK is manufactured without any soldering points. The interconnect design requires no 360°C soldering, eliminating human errors during production, breakages and slack joints. No pollutive waste is produced, as no flux material is used in manufacturing.
No Ferrite Core Required: Interferences and loss in signal quality are reduced considerably by the patented TTL RF-BLOK, hence rendering a ferrite core superfluous. Cables without a ferrite core can be laid much more flexible.